Is there an operator Work Instruction (WI) for each manufacturing processes?是否有WI？ ■ √
Is the WI(Work Instruction) revised and updated?WI版本是否更新？□ ■ √
Is the operator wearing ESD wrist strap in handling ESD sensitive materials? 操作者拿ESD敏感部品是否帶靜電手腕帶？□ ■ √
Does the machine & equipment are grounded?機器和設備是否接地？□ ■ √
Is the component FIFO controlled in the storage bins? How?干燥箱里的部品是否控制先進先出？如何控制？□ ■ √
Is component stock controlled in the warehouse?倉庫里的部品存放是否控制？□ ■ √
Is the room temprature & humidity controlled?室內是否有溫濕度控制？□ ■ √
Is the moisture prevention countermeasure of IC type established?是否有IC防濕的預防措施？□ ■ √
Are measurement instruments calibrated by periods?是否定期校驗測量工具？□ ■ √
Solder Paste Printer焊膏絲印
Is the storage fridge temperature of Solder Paste controlled?是否對存放焊膏的電冰箱溫度進行控制？□ ■ √
Is the Solder Paste FIFO controlled in the storage fridge? 電冰箱里存放的焊膏是否進行了先進先出的控制？如何控制？□ ■ √
Is the expiry date of the Solder Paste controlled?是否對焊膏 的有效期進行控制？□ ■ √
Is the Solder Paste agitator used?焊膏是否攪拌使用？□ ■ √
Does the Screen Print machine have the capability to automatically clean the solder mask? 絲印機器是否有自動清洗鋼網的能力？ □ ■ √
Standard chip mounter 標準部品貼裝
Is the component loading set-up cross checked by another operator before machine start up?開機前是否有作業者相互對資材上料進行交叉檢查？ □ ■ √
Is the repair history of feeder controlled?進料器的維修歷史記錄是否被控制？ □ ■ √
Is the nozzle cleaning implemented by periods?吸嘴是否定期進行完全清潔？ □ ■ √
Odd chip mounter 異型部品貼裝
Is the component loading set-up cross checked by another operator before machine start up?開機前是否有作業者相互對資材上料進行交叉檢查？ □ ■ √
Is the repair history of feeder controlled?進料器的維修歷史記錄是否被控制？ □ ■ √
Is the nozzle cleaning implemented by periods?吸嘴是否定期進行完全清潔？ □ ■ √
Is the loading direction of components specified?是否規定了部品的裝載方向？ □ ■ √
Vision Inspection (pre / post Reflow)目檢
Is the visual inspection implemented using magnifier?目檢是否使用放大鏡？ □ ■ √
Is there AOI tested component ? 是否有AOI測試部品? □ ■ √
Is OK & NG PCBA seperated each location? Ok與NG的PCBA 是否區分擺放? □ ■ √
Reflow Soldering回流焊
Is there evidence that a Temperature Profile is conducted on daily basis? 是否有證據表明溫度曲線每日常規檢查都管理？ □ ■ √
Is there temperature profile check jig each model?是否每個型號都有溫度曲線檢查JIG？ □ ■ √
Have at least three thermocouples been used at various points on the board to establish the Profile? 是不是有3個熱電耦使用在板子上的不同點來確定曲線？ □ ■ √
Does the VDU displayed temperature set points / belt speed match those on the current Temperature Profile?當前的溫度曲線是否符合VDU 溫度設置? □ ■ √ |
